We perform thermal simulations on PCBAs, analyzing temperature distribution, maximum component temperatures under various operating conditions, and performance across different ambient temperatures. These simulations can be conducted with or without heat dissipation solutions, assessing the impact of heatsinks and passive cooling strategies.
Our expertise extends to both external PCBAs and in-house designs, where we collaborate closely with our HW design team to iterate and optimize component layout from a thermal perspective. This approach ensures system reliability while enhancing thermal efficiency.
